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Announcement of Weijian Intelligence's Patent for 'Glue Dipping Tray Module, Glue Dipping Device, and Die Bonder'
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Author：小编
Weijian Intelligence Packaging Technology (Shenzhen) Co., Ltd. has officially unveiled a patent titled "A Glue Dipping Tray Module, Glue Dipping Device, and Die Bonder," bearing the application publication number CN119608484A and published on March 14, 2025. This patent potentially represents advancements in the realm of semiconductor component packaging and testing equipment, with the primary objective of enhancing the efficacy of die bonders.
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