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Secondary Market for Technology Innovation Bonds Thrives, Hitting Over RMB 200 Billion in Trading Volume in May
2 week ago /
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Author：小编
On May 7, a comprehensive policy package was unveiled to bolster the issuance of technology innovation bonds. The concerted efforts of these measures have markedly invigorated trading activity in the secondary market for such bonds. Specifically, in May, the trading volume of technology innovation bonds surged to RMB 204.096 billion, marking a monthly increase of 65.25% and a yearly surge of 214.92%. This data, sourced from Wind Information, encompasses science and technology innovation notes traded in the interbank market, as well as technology innovation corporate bonds listed on the Shanghai, Shenzhen, and Beijing Stock Exchanges.
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