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On June 5, CITIC Securities issued a research report emphasizing that Broadcom has commenced shipments of its latest generation of Tomahawk 6 switching chips, amid robust market demand. These chips boast a substantial performance enhancement, enabling the deployment of million-scale XPU clusters. CITIC Securities maintains that the acceleration of network speeds and the expansion of computing clusters are enduring trends, and anticipates that the mass production of Tomahawk 6 will propel significant growth in the demand for 1.6T optical modules and data center interconnect (DCI) solutions. Furthermore, Tomahawk 6 has introduced a co-packaged optics (CPO) variant, expected to expedite the maturation of CPO solutions. Consequently, manufacturers specializing in high-speed datacom modules, DCI interconnects, and CPO solutions stand to benefit from these developments.
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