On June 4, Gree Electric announced the successful establishment of a process platform for Silicon Carbide (SiC) Schottky Barrier Diode (SBD) and Metal-Oxide-Semiconductor (MOS) chips. Notably, several products have already been implemented in batches within the company. Furthermore, as a distinguished chip manufacturing facility, Gree Electric extends its services to multiple chip design companies by offering wafer tape-out manufacturing solutions.
