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According to Apple analyst Jeff Pu, the upcoming iPhone 18 Pro, iPhone 18 Pro Max, and iPhone 18 Fold are poised to integrate the groundbreaking A20 chip, leveraging TSMC's advanced 2-nanometer process. This leap in technology promises a notable 15% enhancement in performance and a commendable 30% reduction in power consumption when compared to its predecessor, the A19 chip. Furthermore, the A20 chip introduces an upgraded WMCM packaging innovation, seamlessly integrating RAM onto the chip wafer. This advancement not only amplifies performance but also extends battery life, enhances thermal management, and minimizes package size, thereby optimizing the internal layout of these devices. All three models are anticipated to hit the market in September 2026.
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