Innolux Bets on FOPLP Technology, Hung Chin-yang Confirms Tangible Results in 2023 - Chip

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Innolux Bets on FOPLP Technology, Hung Chin-yang Confirms Tangible Results in 2023

1 day ago / Read about 0 minute

Author：小编

The surge in artificial intelligence (AI) continues unabated, with advanced packaging technology emerging as a pivotal factor in enhancing AI chip performance. After the introduction of vertically stacked CoWoS packaging, Fan-Out Panel-Level Packaging (FOPLP) technology has garnered significant industry attention due to its capacity to substantially boost chip utilization. In an exclusive interview, Hung Chin-yang, Chairman of Innolux, affirmed that the company's FOPLP technology will deliver tangible results and commence shipments this year, with aspirations to capture a share of the global semiconductor packaging market.

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