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Intel Unveils Enhanced EMIB-T Packaging Technology for HBM4 and UCIe
2025-05-31 /
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Author：小编
At the Electronic Components Technology Conference (ECTC) this week, Intel introduced the EMIB-T technology, marking a substantial advancement in its Embedded Multi-die Interconnect Bridge (EMIB) packaging technology. Initially showcased at Intel Foundry Services' Direct Connect 2025 conference, EMIB-T seamlessly integrates Through-Silicon Vias (TSVs) and high-power Metal-Insulator-Metal capacitors into the existing EMIB architecture. This enhancement aims to provide higher-density, shorter-path inter-chip connectivity, catering to the stringent requirements for bandwidth, density, and energy efficiency in high-performance computing, AI accelerators, and data center System-on-Chips (SoCs).
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