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On May 30, Sheng Wenjun, Director and General Manager of Telink Semiconductor, disclosed during a performance briefing that the company is closely monitoring the evolution of EdgeAI technology. Telink has successfully introduced a range of chips, including the TL721x and TL751x, which support edge computing and AI applications. These chips are widely utilized in smart homes, smart offices, and wireless audio domains. Looking ahead, Telink Semiconductor aims to accelerate internal R&D efforts, strengthen fundamental AI capabilities and application strategies, and significantly increase investment in advanced manufacturing processes like 22nm. These initiatives are expected to enhance product lines, optimize chip costs, and bolster overall performance.
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