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Deca and IBM have jointly announced a partnership aimed at introducing the M-series Fan-Out Wafer-Level Packaging (FOWLP) technology and adaptive patterning technology to IBM's Bromont facility in Canada. This collaboration will result in the establishment of a dedicated mass production line for the Multi-Function Integrated Technology (MFIT). MFIT technology excels in facilitating double-sided routing and dense 3D interconnects, making it ideally suited for complex heterogeneous integration scenarios. By efficiently replacing full-silicon interposers, MFIT enhances signal integrity and design flexibility. This strategic alliance further bolsters IBM's technological prowess in advanced packaging, empowering customers to expedite the deployment of high-performance AI computing solutions.
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