Search
Samsung Electronics Aims to Introduce Glass Interposer Technology by 2028
2025-05-27 /
Read about 0 minute
Author：小编
By 2028, Samsung Electronics intends to revolutionize semiconductor manufacturing by substituting silicon substrates with glass substrates for the production of high-performance AI chips. This shift, aimed at transitioning from "silicon interconnect" to "glass interconnect," is designed to achieve cost reductions and enhanced performance. To expedite prototyping and swift market entry, Samsung is developing glass substrate units measuring less than 100x100 millimeters. Additionally, the company is engaging in discussions with supply chain partners regarding the implementation of "unit" forms of glass substrates.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
