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TrendForce: Elevated HBM4 Specifications Heighten Manufacturing Hurdles, Premium Forecast to Surpass 30%
2025-05-22 /
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Author：小编
On May 22, TrendForce unveiled a new research report emphasizing that the burgeoning demand for AI servers is propelling the three leading original equipment manufacturers (OEMs) to expedite the development of HBM 4 products. The significant increase in I/O count for HBM 4 has introduced more intricate chip designs and necessitated larger wafer areas. Consequently, some suppliers are embracing logic chip architectures to bolster performance, a move that further escalates costs. Considering that HBM 3e debuted with a premium of approximately 20%, it is anticipated that the premium for HBM 4, due to its heightened manufacturing complexities, will surpass 30%.
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