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Innolight Achieves Micrometer-Level Precision in Wafer-Level Glass Processing, Facilitating Batch Deliveries
2025-05-20 /
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Author：小编
In a recent institutional survey, Innolight announced that its advanced wafer-level glass processing equipment now boasts capabilities for automated batch cutting and chipping, achieving precision at the micrometer level. This groundbreaking technology has already enabled the company to make batch deliveries to AAC Technologies.
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