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Biwin Storage: Advanced Wafer-Level Packaging and Testing Facility Under Construction, Scheduled for Production in Late 2025
2025-05-16 /
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Author：小编
Biwin Storage is currently developing a state-of-the-art wafer-level packaging and testing facility, with an anticipated launch date in the second half of 2025. This ambitious project encompasses advanced packaging technologies such as Chiplet, RDL, Fanout, and SiP, tailored to cater to the evolving demands of high-performance DRAM memory, NAND memory, and the convergence of storage and computing solutions.
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