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Inspur Information Successfully Issues 1 Billion Yuan in Science and Technology Innovation Bonds
2025-05-16 /
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Author：小编
On May 15, 2025, Inspur Information Company successfully launched the third phase of its science and technology innovation bonds on the national interbank bond market, raising a total of 1 billion yuan at an interest rate of 1.70%. The entire proceeds from this bond issue were promptly received the following day. The issuance was led by Bank of China as the lead underwriter, with China CITIC Bank serving as the co-lead underwriter.
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