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Hengfeng New Materials Secures Tens of Millions in Pre-B Funding, Bolstering Localization of Semiconductor Packaging Materials
2025-05-14 /
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Author：小编
Hengfeng New Materials has successfully concluded its Pre-B round of financing, securing tens of millions of yuan from a consortium of investors including Yida Capital, YaoTu Capital, and Lingang Digital Technology Fund. This infusion of capital will primarily be directed towards enhancing the company's product supply chain and facilitating strategic market expansion for its electronic-grade special phenolic resin and special phenolic epoxy resin. Hengfeng New Materials, a specialist in core materials for semiconductor packaging, sees its products finding widespread application in copper clad laminates, photoresist, and various other domains.
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