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Intel is delving into a groundbreaking chip cooling technology that involves intricately weaving microscopic water channels within the processor package. At the Foundry Direct Connect event, as detailed by HardwareLuxx, Intel showcased functional prototypes of LGA desktop CPUs, BGA servers, and AI modules that are equipped with this advanced cooling system. This innovative approach significantly boosts cooling efficiency by etching microfluidic channels onto the rear of the chip and employing 3D-printed manifolds to facilitate the circulation of coolant between micro-pins. Experimental data indicates that this technology can slash thermal resistance from the junction to the inlet by an impressive 44% and reduce coolant consumption by a factor of 30, thereby enhancing data center operations both in terms of efficiency and environmental sustainability.
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