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Apple and AMD Bolster TSMC's SoIC Capacity Expansion
2025-04-28 /
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Author：小编
Despite economic uncertainties, TSMC's management has affirmed its commitment to operational fundamentals. The company is steadily increasing its advanced packaging capacity to align with customer demands. Notably, the growth in capacity for the innovative SoIC packaging platform is outpacing all other process technologies, largely attributed to the support from two key customers: Apple and AMD.
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