On March 7, 2025, HJ Semiconductor Packaging Pilot Technology R&D Center Co., Ltd. successfully published its patent for the 'Active Optical Chip Interposer and Its Manufacturing Method,' bearing the application publication number CN119575544A. This patent delves into the realm of interposer technology, encompassing the creation of a protective layer, the implementation of a through-silicon via (TSV) structure, and additional steps aimed at minimizing process contamination and damage, thereby safeguarding the optimal performance of the interposer.
