HJ Semiconductor's Patent for 'Active Optical Chip Interposer and Manufacturing Method' Officially Published
2025-04-26 / Read about 0 minute
Author:小编   

On March 7, 2025, HJ Semiconductor Packaging Pilot Technology R&D Center Co., Ltd. successfully published its patent for the 'Active Optical Chip Interposer and Its Manufacturing Method,' bearing the application publication number CN119575544A. This patent delves into the realm of interposer technology, encompassing the creation of a protective layer, the implementation of a through-silicon via (TSV) structure, and additional steps aimed at minimizing process contamination and damage, thereby safeguarding the optimal performance of the interposer.