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Samsung Encounters Hurdles in HBM3E Certification, Prompting Google to Switch AI Chip Suppliers
2025-04-25 /
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Author：小编
Samsung Electronics' HBM3E product has encountered challenges, failing to secure certification from NVIDIA and being excluded from TSMC's CoWoS packaging line. Consequently, Google has opted to utilize Micron products for its in-house AI server chips. Samsung has assured that this development has not impacted their overall plans. However, supply chain insiders have disclosed that the initial plan to supply NVIDIA in bulk during the first quarter of 2025 has been derailed. On the other hand, SK Hynix is ahead in the realm of 12-layer HBM3E technology and is projected to command over half of the HBM3E market by the second quarter of 2025.
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