Intel and Black Sesame Technologies Collaborate on Cabin-on-Wheel Platform with MoU Signing - Chip

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Intel and Black Sesame Technologies Collaborate on Cabin-on-Wheel Platform with MoU Signing

2025-04-23 / Read about 0 minute

Author：小编

At the Shanghai Auto Show, Intel and Black Sesame Technologies formally inked a memorandum of understanding (MoU), heralding a joint venture to merge their expertise in cockpit chips and assisted driving technology. The aim is to develop an innovative cabin-on-wheel platform that seamlessly blends advanced assisted driving capabilities with immersive cockpit experiences. This cutting-edge platform promises to deliver a smarter and safer driving environment for users. The partners anticipate unveiling the platform's reference design in the second quarter of this year, paving the way for mass production.

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