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Xingsen Technology: FCBGA Packaging Substrate Project Ready for Mass Production
2025-04-17 /
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Author：小编
On April 17, Xingsen Technology announced that its FCBGA packaging substrate project has successfully concluded preparations for mass production, encompassing both production capacity expansion and optimized product yield rates. This achievement paves the way for technical support in the large-scale manufacturing of domestic AI computing power GPUs. Notably, the yield rate for the project's low-level boards surpasses 95%, while the high-level boards maintain a stable yield rate of over 85%. The company anticipates initiating material feeding production for high-level boards in the fourth quarter of 2025.
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