The Japanese government intends to inject 100 billion yen (approximately 4.811 billion yuan) into the semiconductor firm Rapidus in the latter half of this year. This investment will be sourced from the issuance of a novel government bond known as the "Advanced Semiconductor and AI Technology Bond." Notably, the government had previously committed to investing 920 billion yen in Rapidus, yet the company still confronts a funding shortfall of approximately 4 trillion yen. Rapidus is focused on the research, development, and mass production of 2nm chips, with its initial fabrication facility progressing seamlessly and scheduled to commence trial production in April 2025. Furthermore, the Japanese government aims to provide at least 10 trillion yen in financial support to the AI and semiconductor industries by fiscal year 2030. Rapidus also envisions collaboration with the US semiconductor giant Broadcom for the production of 2nm chips, aiming to expedite their commercialization process.