Search
HACQ Tech Publishes Patent for "Wafer Drying Device and Wafer Drying Method"
2025-02-05 /
Read about 0 minute
Author：小编
On November 13, 2024, HACQ Tech (Beijing) Co., Ltd. saw the publication of its patent titled "Wafer Drying Device and Wafer Drying Method," bearing the publication number CN119133038A. This innovative patent comprises a chuck, support structure, rotating mechanism, and liquid recovery system, among other components. It boasts an optimized liquid discharge pathway, significantly enhancing the drying effectiveness and efficiency of liquid recovery processes.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
