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Naura Technology Secures Patent for 'In-Situ Detection Device and Method for Edge-Cut Wafers'
2025-01-27 /
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Author：小编
Naura Technology Co., Ltd. has recently been granted an invention patent entitled 'In-Situ Detection Device and In-Situ Detection Method for Edge-Cut Wafers'. The patent authorization number is CN114267605B, with the authorization date marked as December 31, 2024. The application for this patent was submitted on December 27, 2021. The primary objective of this patent is to enhance the precision and efficiency of in-situ detection for edge-cut wafers. By employing specialized devices and methodologies to ascertain the correct positioning of wafers, it significantly reduces production errors, elevates the level of automation in semiconductor manufacturing processes, and ultimately boosts yield rates.
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