Search
TSMC Announces Scrapping of 30,000 Damaged Wafers Following Earthquake
2025-01-24 /
Read about 0 minute
Author：小编
Following a 6.4-magnitude earthquake that hit the southern Taiwan Science Park, TSMC swiftly evacuated its employees and conducted a thorough inspection of its facilities. The company confirmed that there were no injuries and no structural damage to the facilities. Fab 18 is scheduled to fully resume production on the 23rd, whereas the restart date for Fab 14 remains undetermined. The earthquake resulted in the damage of over 55,000 wafers, with estimated losses exceeding NT$3 billion. TSMC assured that water supply, electricity, safety systems, and operations across all plants are functioning normally. Detailed inspections and impact assessments are currently underway.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
