On November 6, according to The Information, two sources said that TSMC is considering expanding its advanced memory chip manufacturing business—a move that would allow it to capture a larger share of the global AI hardware supply chain. TSMC has recently begun drafting plans to produce 3D DRAM in response to a request from its largest customer, NVIDIA. DRAM stands for dynamic random access memory, which is used to temporarily store data while a processor is using it. Unlike traditional DRAM, which places memory cells on a single layer, 3D DRAM vertically stacks cells to accommodate more memory. Currently, memory chip manufacturing is dominated by Samsung Electronics, SK Hynix, and Micron Technology, all of which are also developing 3D DRAM technology as they compete in next-generation memory manufacturing. The severe memory chip shortage triggered by the AI hardware boom has sent prices soaring, prompting chip design companies such as NVIDIA and Apple to seek additional sources of supply. Earlier this year, Apple raised device prices due to rising memory costs.