BOE A announced on November 6 during a targeted survey that the company has achieved full-process integration of glass-based packaging carrier board manufacturing — covering high-aspect-ratio TGV openings, deep-hole copper filling, low-stress metal wiring, high-layer-count lamination, high-density wiring, and low-stress cutting — and now possesses complete glass-based packaging carrier board manufacturing capabilities. Currently, the company's pilot line has achieved fully automated equipment connectivity, has produced 24-layer (11-211) glass-based packaging carrier boards exceeding 100×100mm in size, and has delivered samples. Customer samples have passed the relevant reliability tests.