Samsung Electronics is planning to break ground in November 2026 on its second wafer foundry in Taylor, Texas, USA (Taylor Fab 2). Its planned capacity has reportedly been fully booked by customers, with most orders coming from AMD, while NVIDIA also has capacity arrangements in place. Samsung officials said they cannot confirm specific customer-related details. Taylor Fab 2 covers about 250,000 square meters, roughly 1.5 times the size of Taylor Fab 1, and will use a 2nm process. The line is expected to begin equipment move-in in February 2029 and enter formal mass production in 2030. Unlike Taylor Fab 1, which mainly handles advanced logic foundry orders such as Tesla AI chips, Fab 2 will specifically serve the AI computing power supply chain, dedicated to producing base dies required for high-bandwidth memory (HBM).