BOE A disclosed during an institutional research survey that the company has achieved full-process integration across glass substrate packaging carrier board manufacturing, encompassing high-aspect-ratio TGV drilling, deep-hole copper filling, low-stress metal wiring, high-layer-count lamination, high-density wiring, and low-stress cutting. The company now possesses complete manufacturing capabilities for glass substrate packaging carrier boards. Currently, the pilot line has achieved fully automated equipment connectivity, producing 24-layer (11-2-11) glass substrate packaging carrier boards exceeding 100×100mm in size, with samples already delivered. Customer samples have passed relevant reliability tests.