Kinwong announced on November 5 during a targeted survey that the company has achieved mass shipments of PCBs for 800G and 1.6T optical modules, with many customers providing relatively clear guidance for the coming years. As mSAP capacity is released in an orderly manner, the company is accelerating the introduction of additional downstream customers and remains upbeat about the growth rate of 1.6T optical module PCBs and the associated technical requirements for NPO, CPO, and CPC.