Qualcomm has announced that its first-generation high-bandwidth compute (HBC) chip has completed hardware verification, successfully testing the full memory read/write path and near-memory computing capabilities. This technology is designed to reduce data movement, boost bandwidth and energy efficiency, and lower both power consumption and cost for AI inference. A data center product built on this technology has already completed tape-out and is currently undergoing preliminary testing of its logic base die and stacked DRAM. The Dragonfly AI250, which incorporates HBC technology, is expected to offer samples in the first half of 2027.