Samsung Electronics' foundry division has scored a significant win. According to a Nov. 3 report from South Korea's Maeil Business Newspaper, Samsung has secured an order from AMD for next-generation high-bandwidth memory (HBM) base dies and plans to manufacture them at its second wafer fab under construction in Taylor, Texas (Taylor Fab 2). Nearly all planned capacity at the plant has already been reserved by customers, with AMD taking the lion's share.