On November 2, AMEC announced at an analyst meeting that PECVD and CuBS PVD are among its higher-value thin-film deposition products. The company's PECVD equipment features 16 reaction stations and utilizes the latest plasma source, delivering higher deposition rates and 80% to 100% higher throughput than comparable standard equipment at home and abroad. New products, including PECVD silicon nitride-oxide stacks and carbon hardmasks, are progressing smoothly through customer verification. The CuBS PVD equipment, equipped with 14 reaction chambers and a symmetrical dual-path design, significantly reduces BS resistivity and achieves 50% to 100% higher throughput than comparable standard equipment at home and abroad. It has been recognized by multiple leading customers and delivered to a domestic advanced logic device R&D line for verification. EPI equipment is critical for advanced logic processes. The company's reduced-pressure epitaxy equipment has been shipped to advanced-process customers and entered the mass production verification stage, while its atmospheric-pressure epitaxy equipment is also entering the wafer verification stage.