During a conference call on November 1, Guangzhi Technology disclosed that its indium phosphide substrate business serves downstream optical communication chip and device manufacturers both domestically and internationally, and that batch deliveries have already been achieved. Domestic customer demand is shifting from 2-inch and 3-inch wafers to 4-inch, while overseas customers are moving from 4-inch to 6-inch. In light of the expected explosive growth in demand for large-size wafers, the company has prepositioned capacity for 6-inch substrates and continues to advance process optimization, yield improvement, and customer development for large-size substrates. Its 6-inch indium phosphide substrate has already received orders from a leading global customer and is expected to continue benefiting from customer demand growth going forward.