Shennan Circuits announced in an institutional research survey that its Guangzhou production base is steadily releasing production capacity in the third quarter of 2026, with continuous improvements in product line capabilities. The capacity ramp-up of BT-type packaging substrates is progressing steadily. FC-BGA packaging substrates have achieved mass production capability for products with 26 layers and below, while technology R&D and sample-making for products with 30 layers and above are proceeding on schedule.