On October 30, Xinhe Semiconductor launched Agent Evo, its Agentic AI super-intelligent agent platform, at the 2026 Xinhe User Ecosystem Conference. Designed for chip and system scenarios governed by Tao's Law, the platform orchestrates engineering tasks and comes with three built-in super-intelligent agents: advanced packaging, packaging and PCB, and multiphysics coupling. Jiang Liguo, Vice President of R&D, said the platform uses time miniaturization as the driving force for collaborative optimization architecture, which can boost design iteration efficiency by four times and cut manual operations by 80%.