On October 27, news broke that the 24th China Annual Semiconductor Packaging Test Technology and Market Conference (henceforth referred to as the "Packaging and Testing Conference") is slated to be held from November 4 to 6 at the Fengda International Hotel in Nanjing. This three-day event is expected to attract prominent players in the semiconductor packaging and testing sector, as well as firms specializing in chip design, glass substrates, and cutting-edge packaging and testing equipment. Key participants include Huatian Technology, Changdian Technology, Tongfu Microelectronics, Nanjing TSMC, Biren Technology, BOE, Yuntian Semiconductor, among others. Attendees will delve into the newest trends in advanced packaging through main forums, specialized reports, supply-demand matching sessions, and various other formats. At present, with Moore's Law nearing its physical constraints and AI computing power surging forward, semiconductor packaging and testing technologies are experiencing continuous evolution. Advanced packaging and testing have emerged as a pivotal factor in boosting chip performance, fostering industrial innovation, and representing a new strategic vantage point for the growth of the semiconductor industry.