Applied Materials plans to increase its stake in fellow chip equipment manufacturer Besi to approximately 20% of the outstanding shares, subject to U.S. antitrust review. The two companies, which have a six-year collaboration history, will deepen their cooperation on advanced chip packaging technologies for AI applications, focusing on new chip connection and packaging technologies to support the development of next-generation AI semiconductors. Applied Materials stated that this is a long-term investment, with no intention of further increasing its stake beyond 20% or seeking a seat on Besi's board. Previously, Besi had dismissed market speculation that ASML would become its competitor in the hybrid bonding sector.
