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Recently, the Software Defined System-on-Wafer Technology and Industry Alliance (hereafter referred to as the SDSoW Alliance) convened its 2026 annual council meeting in an online format. The gathering zeroed in on pivotal matters, including the restructuring of council units, the onboarding of fresh members, amendments to the alliance's charter, and the management of the System-on-Wafer Innovation Center. Following thorough discussion and a vote among all council members, the School of Integrated Circuits at Hubei University was formally welcomed as a member unit of the SDSoW Alliance. This membership is set to offer the school a crucial collaborative platform, facilitating independent chip technology innovation and fostering connections within the industrial chain resources during the post-Moore era.
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