On October 13, during the 2026 Kirin Media Communication Event, Xu Songyu, who heads up Wireless Terminal Chip Product Management within Huawei's Semiconductor Business Division, presented the intricate architecture diagram of the logic-folded Tao chip, the Kirin 9050 Pro, to the public for the very first time. The architecture seamlessly integrates the collaborative efforts of various components, including the cutting-edge Lingxi CPU, the high-performance Maliang GPU, the Da Vinci architecture NPU, the Kirin AI ISP, the Balong AI Modem, the FFTS function stream task scheduler, the audio and video processor, the security processor, and the Lingxi microkernel.

Xu Songyu also disclosed that the next-generation Kirin 2027 chip has reached completion, with all test results aligning perfectly with expectations. Moreover, he emphasized that the chip's evolution over the next decade (through logic folding) is set to be sustainable. Further discussions on the specific stages of this evolution and the technologies required will be carried out in a phased manner.