Search
TSMC Aims to Start Advanced Packaging Production in the U.S. in the First Half of 2028
2 day ago /
Read about 0 minute
Author：小编
On October 12, according to a report by Taiwanese media outlet Commercial Times, TSMC has established a critical timeline for its advanced packaging layout in the United States. GlobalFoundries has signed a US$2 billion manufacturing agreement with TSMC, planning to mass-produce key COWOS silicon interposers in the U.S. in the first half of 2028. Meanwhile, Amkor's Arizona facility is also scheduled to commence production in early 2028, aligning the timelines of the two major supply chains. Industry sources speculate that TSMC's first advanced packaging plant in Arizona could begin operations as early as the first half of 2028, with market attention focused on whether it will initiate trial production ahead of schedule.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
