Yu Chengdong Unveils: Domestic Research and Industrial Forces Tackle Key Hurdles in EUV Lithography Machine Development
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Author:小编   

Yu Chengdong, Chairman of Huawei's Terminal Business Group (BG), recently shared the latest advancements in Huawei's terminal business and the HarmonyOS ecosystem at a media exchange event. He stated that Huawei had long been committed to global cooperation. However, since 2019, the company has collaborated with domestic supply chains to surmount numerous challenges. By harnessing local technologies, Huawei has established advanced chip manufacturing capabilities and achieved independent development of its operating system, thereby constructing a localized supply chain system. In 2023, Huawei resumed the domestic production of smartphone chips, significantly reducing its dependence on U.S. technologies.

Currently, the total number of devices equipped with HarmonyOS 6 and HarmonyOS 7 has surpassed 90 million, with expectations to exceed 100 million by the end of the year. The HarmonyOS platform boasts over 450,000 applications and services, supported by 11 million globally registered developers and more than 23,000 application innovation partners. Looking ahead, HarmonyOS will steadily expand its presence in overseas markets.

Yu Chengdong also highlighted that EUV lithography machines are vital equipment for manufacturing cutting-edge advanced chips. Domestic scientific research and industrial teams are fully engaged in overcoming key challenges in their development. At present, the mainstream processes for domestic chip mass production mainly rely on localized DUV lithography equipment. Huawei has pioneered a logical folding technology that substantially boosts overall chip computing power without relying solely on process node advancements. Additionally, Huawei has shifted its technical approach from a singular focus on single-chip process node metrics to a systems engineering perspective. This involves optimizing overall device performance through comprehensive improvements across the entire chain, including architectural innovation and collaborative tuning of hardware and software. This strategy compensates for the current limitations in accessing the most advanced process nodes.