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On October 8th, it was reported that an investor asked Hongli Zhihui whether, amidst the burgeoning development of AI, the company planned to capitalize on its technical expertise in MicroLED glass substrates to venture into the realm of glass substrates used in PCBs. Additionally, the investor inquired whether Hongli Zhihui had technical reserves in TGV technology. On that very day, Hongli Zhihui clarified its position, stating that as an LED semiconductor packaging device enterprise, it seamlessly integrates R&D, production, and sales. Its core businesses encompass LED semiconductor packaging, innovative Mini/MicroLED displays, and automotive lighting solutions. Regarding glass substrate packaging technology, the company's MicroLED division already boasts the packaging prowess to support a comprehensive range of P0.6 - P1.2 glass-based MicroLED products.
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