On October 7th, Nikkei News reported that Samsung Electro-Mechanics is set to invest close to $5 billion in South Korea and Vietnam by 2028, aiming to ramp up the production of semiconductor substrates. This strategic move is poised to further cement Vietnam's foothold in manufacturing critical components for AI servers and high-performance computing. As a subsidiary of Samsung Group specializing in electronic components, Samsung Electro-Mechanics unveiled two investment plans for FC-BGA (Flip Chip Ball Grid Array) substrates last week. These substrates are integral to AI servers, robotics, and smart automotive chips. Specifically, the Sejong plant in South Korea will see an investment of 4.27 trillion won (around $3.2 billion), representing Samsung Electro-Mechanics' most substantial single-product investment to date. Meanwhile, its Vietnamese subsidiary will receive an investment of 2.51 trillion won (approximately $1.87 billion). Earlier, in 2022, Samsung Electro-Mechanics had announced the trial production of FC-BGA substrates in Thai Nguyen Province, northern Vietnam. The current expansion of this facility underscores the triumph of the trial run, paving the way for the company to embark on large-scale mass production.