Huawei's groundbreaking LogicFolding (Logical Folding) 3D chip architecture has recently rekindled interest within the semiconductor sector. Based on information disclosed by Huawei, this architecture ingeniously shortens signal transmission paths. It achieves this by reconfiguring the internal logic circuits of the chip and employing a vertical three-dimensional layout. Concurrently, it substantially cuts down on the number of buffers needed for the clock network.

However, certain experts in the semiconductor industry have raised concerns. They acknowledge that while this architecture does bring about a reduction in some signal transmission costs, tackling the heat dissipation challenges associated with 3D chips remains an arduous task. This heat dissipation issue could potentially emerge as a significant barrier to the large-scale deployment and expansion of this architecture.