Corelink Integrated Circuit Secures 2.129 Billion Yuan in Capital Injection to Propel Construction of 50,000-Wafer Automotive-Grade Chip Production Line
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Author:小编   

On September 21, Corelink Integrated Circuit made public that it had successfully fulfilled its full subscribed capital commitment to its joint venture, Corelink Advanced, culminating in a cumulative paid-in registered capital of 2.129 billion yuan. Post-investment, Corelink Integrated Circuit emerges as the largest shareholder, securing a 25.1% equity stake in Corelink Advanced. The allocated funds are earmarked exclusively for the development of Corelink Advanced's Phase IV initiative, which aims to establish a state-of-the-art production line capable of manufacturing 12-inch automotive-grade digital-analog mixed chips, with an impressive monthly output capacity of 50,000 wafers.