On September 21, according to industry insiders, Samsung has laid out plans to significantly ramp up the outsourced cleaning volume of glass carriers utilized in its HBM (High Bandwidth Memory) manufacturing process. Specifically, the volume is projected to surge from 20,000 wafers per month this year to a staggering 50,000 wafers per month in the coming year, marking a fivefold increase compared to the previous year. Glass carriers serve as temporary support frameworks, strategically placed at the base of DRAM wafers during HBM production. Their primary role is to safeguard the wafers from bending or cracking amidst the etching and drilling procedures. Given that glass carriers are reusable components, their frequency of use is contingent upon the feeding methodology and the efficiency of the production process.

Nevertheless, the notable 2.5-fold escalation in cleaning demand strongly hints at a substantial uptick in Samsung's HBM4 series production, with expectations of at least doubling next year. Samsung is proactively scaling up its production capabilities for both HBM4 and HBM4E variants, both of which incorporate a high-stacking architecture boasting over 12 layers. This move underscores Samsung's commitment to staying at the forefront of memory technology innovation and meeting the escalating demand for high-performance memory solutions.