Galaxy Microelectronics has made an announcement detailing its strategic move to bolster the production, processing, and manufacturing prowess of its discrete integrated circuit devices, alongside expanding its production capacity. To achieve this, the company intends to allocate 1.078 billion yuan, sourced from its internal reserves or raised capital, towards the execution of the 'High-End Core Device Industrialization and Innovation Capacity Building Project.' This ambitious undertaking is slated to unfold over a three-year period, with an anticipated launch date of January 1, 2027.
