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On September 8, 2026, Intel was granted a U.S. patent for an 'IC Package Incorporating Micro LEDs.' This innovative technology involves embedding semiconductor chips, either partially or fully, into a glass substrate, facilitating electrical interconnection via glass vias (TGVs). It allows for real-time visualization of the chip's operational status, customizable lighting effects, and on-site optoelectronic testing, all without the need for external components. This advancement offers a comprehensive optoelectronic heterogeneous integration solution for Co-Packaged Optics (CPO) and high-density computing packaging, having successfully demonstrated the feasibility of integrating silicon chips, Micro LEDs, and TGV glass within a single package.
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