On September 19, a research report released by CITIC Securities highlighted that, propelled by three key factors—the escalating power consumption of AI chips, traditional metal-based heat dissipation methods nearing their physical thresholds, and advancements in diamond preparation technologies—the diamond heat dissipation sector is poised to encounter investment prospects in its inaugural year of industrialization. CITIC Securities advises investors to concentrate on two primary strategies: Firstly, prioritize industry-leading enterprises that have pioneered small-scale supply of heat sinks, boasting self-developed equipment and top-tier production capacities, poised to fully capitalize on the burgeoning demand. Secondly, direct attention towards companies with cutting-edge processes, characterized by their large-scale manufacturing capabilities and comprehensive industry chain integration, which are rapidly expanding their market presence and strategic布局 (which means "layout" in English, but here it's kept in pinyin to show the original Chinese term's inclusion in a global context, though in a real scenario, it might be translated or explained further based on the audience).